Nondestructive determination of plasma processing treatment

Details Nondestructive determination of plasma processing treatment Nondestructive determination of plasma processing treatment

H - Electricity

05

H

H05H 1/00 (2006.01) C23C 14/22 (2006.01) C23C 14/48 (2006.01) C23C 14/54 (2006.01)

Patent

CA 2130167

Plasma processing treatment characteristics of an object (32) are determined nondestructively, prior to plasma processing the object (32), by placing an indicator layer (44) over at least a portion of the plasma processing surface (36) of the object (32), so as to generally conform to the shape of the surface (36). An electrically conductive grid (46) is placed over the indicator layer (44), and made electrically common with the object (32). The indicator layer (44) is implanted through the conductive grid (46), and changes properties responsive to the plasma processing treatment. The implanted indicator layer (44) is thereafter analyzed to determine the treatment characteristics of the indicator layer (44). Plasma processing spatial distribution and total dosage are determined nondestructively from this information and used to establish the plasma processing program for the object (32) and adjust the plasma processing system (20) as needed.

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