Nonwoven bonding patterns producing fabrics with improved...

Details Nonwoven bonding patterns producing fabrics with improved... Nonwoven bonding patterns producing fabrics with improved...

D - Textiles, Paper

04

H

D04H 1/54 (2006.01) A61F 13/15 (2006.01)

Patent

CA 2301123

There is disclosed a thermal bonding pattern for nonwoven fabric comprising a pattern having an element aspect ratio between about 2 and about 20 and an unbonded fiber aspect ratio of between about 3 and about 10. It has been unexpectedly found that such a fabric has a higher abrasion resistance and strength than a similar fabric bonded with different bond patterns of similar bond areas. This combination of strength and abrasion resistance has long been sought after.

L'invention concerne un motif de liage thermique pour tissu non tissé, qui comporte un motif présentant un rapport dimensionnel d'éléments situé entre environ 2 et environ 20, et un rapport dimensionnel de fibres non liées situé entre environ 3 et environ 10. Il a été découvert de façon inattendue qu'un tel tissu présente une résistance et une résistance au frottement plus élevées qu'un tissu similaire lié à l'aide de motifs de liaison différents pour des zones de liaison similaires. Cette combinaison de résistance et de résistance au frottement est recherchée depuis longtemps.

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