Normalized interconnection patterns

Details Normalized interconnection patterns Normalized interconnection patterns

H - Electricity

05

K

356/133

H05K 1/11 (2006.01) H01L 23/50 (2006.01) H01L 23/528 (2006.01)

Patent

CA 1091360

ABSTRACT OF THE DISCLOSURE Herein disclosed is a semiconductor device which includes at least one semiconductor chip forming circuit element thereon and connection patterns being connected to said circuit element or elements. According to the invention, said connection patterns comprise a lower connection pattern, which is normalized and widely applied to many kinds of circuits, and an upper connection pattern, which is positioned on the upper side of said lower connection pattern. Said upper connection pattern and said lower connection pattern are connected in conformity with the circuit to be obtained. - 1 -

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