Novel ester compound and thermosetting resin composition...

Details Novel ester compound and thermosetting resin composition... Novel ester compound and thermosetting resin composition...

C - Chemistry, Metallurgy

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C07D 311/58 (2006.01) B32B 15/08 (2006.01) C07C 69/353 (2006.01) C07C 69/60 (2006.01) C07C 69/74 (2006.01) C07C 69/76 (2006.01) C07D 311/60 (2006.01) C07D 311/78 (2006.01) C07D 311/96 (2006.01) C08G 59/42 (2006.01) C08L 63/00 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2207177

An ester compound prepared by esterifying at least one OH group of a polyhydric phenol as a condensation product of a non-substituted or substituted resorcinol and a carbonyl compound with an organic carboxylic acid having 1 to 20 carbon atoms or a derivative thereof, which necessarily contain an organic carboxylic polyacid having 1 to 20 carbon atoms or a derivative thereof. The ester compound can be used as an epoxy resin curing agent affording a cured article having low dielectric constant, low moisture absorption and sufficient heat resistance.

Ester préparé par estérification d'au moins un groupe OH d'un phénol polyhydroxylé, comme produit de condensation d'un dérivé substitué ou non de résorcinol et d'un composé carbonylé, avec un acide carboxylique de 1 à 20 atomes de carbone ou d'un dérivé de cet acide, consistant nécessairement en un polyacide carboxylique de 1 à 20 atomes de carbone ou d'un dérivé. L'ester peut être utilisé comme agent de réticulation pour résines époxydes, en donnant des articles à faible constante diélectrique, absorbant peu l'humidité, et offrant une résistance thermique suffisante.

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