H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/312 (2006.01) C08L 61/06 (2006.01)
Patent
CA 2194376
An improved method for forming planarization films which remain adhered to substrates upon exposure to heat comprising first applying a polymeric solution containing a low molecular weight novolac resin, a surfactant selected from the group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof, and an optional organic solvent to a substrate, followed by heating the substrate.
L'invention concerne un procédé amélioré de formation de pellicules d'égalisation de surface qui adhèrent aux substrats lorsque ces derniers sont exposés à la chaleur. Le procédé consiste à appliquer sur un substrat une solution polymère contenant une faible masse molaire de novolaque, un agent tensioactif choisi dans le groupe comprenant un hydrocarbure non fluoré, un hydrocarbure fluoré et des combinaisons de ces derniers, et éventuellement un solvant organique, et à chauffer ledit substrat.
Alliedsignal Inc.
Gowling Lafleur Henderson Llp
LandOfFree
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