C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
18/1108, 400/780
C08K 3/16 (2006.01) B29C 41/00 (2006.01) C08K 5/09 (2006.01) C08L 77/00 (2006.01) B29C 41/04 (2006.01)
Patent
CA 1181188
ABSTRACT A rotational moldable polyamide composition, a method of preparing the composition, and a method of rotational molding. The composition contains from about 0.001 percent to about 0.5 percent by weight of a copper compound, preferably cuprous iodide. Preferably, the composition contains from about 0.001 percent to about 0.3 percent by weight of potassium iodide.
401398
Flood Paul W.
Petrucelli Frank
Salatiello Peter P.
Allied Corporation
Riches Mckenzie & Herbert Llp
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