G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 9/00 (2006.01) G01B 11/27 (2006.01) G03F 7/20 (2006.01) H01L 21/30 (2006.01) H01L 21/66 (2006.01)
Patent
CA 2155045
The invention described herein is an alignment system used in semiconductor manufacturing. It is the core component used to align a mask containing a circuit pattern to a wafer during a scanning sequence. The alignment system images an alignment reticle pattern onto a wafer which contains alignment marks. During scanning, the light from the alignment reticle image is reflected and scattered by the wafer and its alignment marks. Multiple detectors are placed at a pupil plane of the alignment system to collect the reflected and scattered light in the bright-field and dark-field regions. The resulting signals and their analysis results in determination of accurate alignment of a wafer. The alignment system does not use or "look through" the projection optics of the scanning photolithographic device. The broadband spectrum used for alignment illumination cannot be used in the projection optics designed for the deep UV wavelengths without undesirable results. The broadband spectrum illumination utilized in the alignment system results in improved detection of wafer alignment marks independent of the various process wafer structures that can be encountered.
Angeley David
Drazkiewicz Stan
Gallatin Gregg
Osler Hoskin & Harcourt Llp
Svg Lithography Systems Inc.
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