One component, hot melt, thermosettable, epoxy containing...

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

CPC

402/143, 400/550

IPC codes

C08G 18/58 (2006.01) C08G 18/10 (2006.01) C08G 18/69 (2006.01) C08G 59/02 (2006.01) C08J 5/12 (2006.01) C09J 175/04 (2006.01) C23C 14/06 (2006.01)

Type

Patent

Patent number

CA 1229192

Description

THERMOSETTING COMPOSITIONS Abstract of the Disclosure This invention relates to a thermoplastic, epoxy pendant, urethane-containing compound which is the reaction product of an epoxy resin containing more than one, preferably two hydroxyl groups and a diol end-capped, with a diisocyanate. The compound is preferably formed in the presence of a heat reactive epoxy curing agent resulting in a one component material usable as a thermoset adhesive, sealant or coating on heating. - 1 -

Application Number

423760

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