C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) B32B 17/10 (2006.01) C08G 59/40 (2006.01) C08G 59/50 (2006.01) H05K 1/03 (2006.01) C08J 5/24 (2006.01)
Patent
CA 2104165
A B S T R A C T ONE PACK SELF CURABLE EPOXY RESIN COMPOSITION The invention relates to a one pack self curable epoxy resin composition comprising i) as epoxy component (a) at least one 1,2-epoxy resin compound having an average of more than one epoxy group per molecule and ii) as curing component (b) at least one reaction product obtainable by reacting at elevated temperature dicyandiamide with a tetrabromobisphenol-A type epoxy resin, said resin having an epoxide equivalent weight of from 330 to 1500 and a bromine content of from 10 to 50% by weight, and iii) as solvent (c) at least one compound being selected from the group represented by the general formula (I) Image (I) wherein R1, R2, R4 and R5 each individually represent hydrogen or C1-3 alkyl, provided at least one of them is C1-3 alkyl, and R3 represents C1-3 alkyl.
Bruynseels Maria J. J.
Yianni Paul A.
Shell Canada Limited
Smart & Biggar
LandOfFree
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