One-pack type curable resin composition

Details One-pack type curable resin composition One-pack type curable resin composition

C - Chemistry, Metallurgy

08

K

C08K 5/544 (2006.01) C08G 65/336 (2006.01) C08G 77/08 (2006.01) C08L 101/10 (2006.01)

Patent

CA 2302869

A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizes (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).

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