C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 20/32 (2006.01) B05D 1/36 (2006.01) C08F 8/00 (2006.01) C08L 33/14 (2006.01) C09D 133/14 (2006.01) C09D 163/00 (2006.01)
Patent
CA 2109104
A stable one package etch-resistant film-forming composition is disclosed. The composition includes a polyepoxide com- ponent having an epoxy equivalent weight on resin solids of less than about 600. The composition further includes a polyacid cur- ing agent having an average acid functionality of greater than 2. The composition is substantially free of basic esterification catal- yst, has a cured softening point of greater than about 20 °C, and is stable for use as a single-component composition. Also disclosed is a process for applying a color-plus-clear composite coating to a substrate which includes applying an acid-catalyzed thermosetting film-forming composition to a substrate to form a basecoat. The process also comprises applying a stable etch-re- sistant film-forming composition to the basecoat which includes a polyepoxide and a polyacid curing agent as described above, wherein the topcoat is substantially free of basic esterification catalyst, has a cured softening point of greater than about 20 °C. The composition and process are useful in original equipment finishing of automobiles and trucks.
Klanica Joseph A.
Mayo Michael A.
Mcmonigal Susan U.
Simpson Dennis A.
Singer Debra L.
Borden Ladner Gervais Llp
Ppg Industries Inc.
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