One-part, heat cured epoxy adhesive

Details One-part, heat cured epoxy adhesive One-part, heat cured epoxy adhesive

C - Chemistry, Metallurgy

09

J

C09J 163/02 (2006.01) C08G 59/18 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2351963

Disclosed is a single component heat activated structural adhesive system. This system cures at 250°F - 300°F in 30 - 60 seconds and achieves 70-90% of final cure, providing sufficient bond strength for handling sheet molding compounds (SMC) or bulk molding compounds (BMC). This system also provides dimensional stability without sagging, running, and read- through. The green strength obtained from the curing cycle provides about 20- 100% Fiber Tear, enough to complete the paint bake step, which the bonded parts are subjected to 300°F - 350°F for 20 - 30 minutes. Following the bake cycle, the cure is complete.

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