Open cycle cooling of electrical circuits

F - Mech Eng,Light,Heat,Weapons – 25 – D

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62/3

F25D 17/02 (2006.01) F25B 19/00 (2006.01)

Patent

CA 1269854

ABSTRACT Apparatus and a method are di closed for cooling a low temperature circuit substrate without the need for a vacuum chamber or total immersion, involving subjecting the circuit to a stream of cold fluid, such as liquid helium, and allowing the fluid thereafter to dissipate into the surrounding environment. The apparatus may include an enclosure for holding the circuit, and means for guiding the fluid onto another portion of the substrate after it strikes the circuit. The exit path for the fluid may fold back past the circuit so as to help convect out heat which enters the vicinity radially from the outside. The circuit may also be cooled indirectly by directing the stream of cold fluid through a thermally conductive block, the block having a small surface thermally connectable to the circuit. Additionally, radiation shields may be placed at desired locations in the apparatus and can be cooled by the waste fluid after it cools the circuit.

522785

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