Opening arrangement

B - Operations – Transporting – 65 – D

Patent

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Details

B65D 53/08 (2006.01) B65D 5/70 (2006.01) B65D 5/74 (2006.01)

Patent

CA 2138307

The invention relates to an opening arrangement with a hole provided in the packaging material and covered by an outer strip. The strip has an unsealed portion folded over the sealed portion of the strip. Once the package has been filled and finally formed, the package is provided with a thermoplastic structure surrounding the strip. The thermoplastic structure includes two parts, a pouring element and a closure element. The closure element is folded over and engages configurationally with the pouring element. A heel is placed on the closure element such that it is located flush with the lower surface of the pouring element. When the lower surface of the pouring element is provided with the same substance, the thermoplastic structure is sealed against the package. In this instance the surface area of the heel will be sealed to the unsealed portion of the strip.

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