Opening arrangement for a package

B - Operations – Transporting – 65 – D

Patent

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Details

206/6, 190/137.5

B65D 47/36 (2006.01) B65D 5/70 (2006.01) B65D 43/02 (2006.01)

Patent

CA 1049427

ABSTRACT OF THE DISCLOSURE The present invention provides an opening arrangement for a package of the type which is provided with a pouring opening located in a preferably plane surface, which opening arrangement comprises a cover strip applied over the pouring opening as well as the surrounding area, the area of the cover strip covering the pouring opening having two or more recessed zones which are situated close to parts of the periphery of the pouring opening and are shaped to extend partly underneath the material edge surrounding the pouring opening.

251545

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