Optical chip packaging via through hole

Details Optical chip packaging via through hole Optical chip packaging via through hole

H - Electricity

01

L

H01L 21/00 (2006.01) H01L 27/15 (2006.01)

Patent

CA 2447348

A method of packaging an optical or an optical chip (32) with an electronic chip (38) that allows for close connections between the two chips. The method reduces parasitic capacitance and inductance, and provides unobstructed optical access while allowing for connection of a heat sink to the electronic chip for cooling.

L'invention concerne un procédé d'encapsulation d'une puce optique, ou d'une puce optique (32) et d'une puce électronique (38) ledit procédé permettant d'obtenir d'étroites connexions entre les deux puces. Ledit procédé réduit la capacité et l'inductance parasites et fournit un accès optique libre tout en permettant la connexion d'un dissipateur thermique à une puce électronique utilisé pour assurer un refroidissement.

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