Optical circuit on printed circuit board

Details Optical circuit on printed circuit board Optical circuit on printed circuit board

G - Physics

02

B

G02B 6/12 (2006.01) G02B 6/42 (2006.01) H01S 3/067 (2006.01) H05K 3/30 (2006.01) H05K 13/04 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2239491

Apparatus for packaging a fiber optic device (10) along with electronic and opto-electronic components upon a printed circuit board (11). Bend members (32) having arcuate shaped guide surfaces (46) for directing fibers (14) between various components are strategically mounted upon the top surface of the board. Passive fiber optic components are also mounted upon support means between bend members (32) so that the fibers (14) entering and exiting the passive component run tangent to the bend radius of the bend members (32). The radius of curvature of the bend members (32) is within the bend tolerance of the fibers (14) used in the device. The bend members (32) and support members (50) are formed of a material having a thermal coefficient of expansion that is about equal to that of the board material whereby thermally induced stresses on the board mounted components are minimized.

Dispositif permettant d'encapsuler un dispositif à fibre optique (10) en même temps que des composants électroniques et optoélectroniques sur une carte imprimée (11). Des éléments d'inflexion (32), qui présentent des surfaces de guidage de forme arquée (46) permettant de diriger les fibres (14) entre les différents composants, sont stratégiquement montés à la surface supérieure de la carte. Des composants à fibres optiques passifs sont également montés sur un système de support entre les éléments d'inflexion (32), de façon que les fibres (14) qui entrent dans le composant passif et qui en sortent courent tangentiellement au rayon de courbure des éléments d'inflexion (32), ledit rayon de courbure étant inférieur à la courbure maximum que peuvent supporter les fibres (14) utilisées dans le dispositif. Les éléments d'inflexion (32) et les éléments de support (50) sont constitués d'un matériau ayant un coefficient d'expansion thermique à peu près égal à celui du matériau de la carte, ce qui permet de minimiser les contraintes thermiques imposées aux composants montés sur la carte.

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