Optical component mounting

Details Optical component mounting Optical component mounting

G - Physics

02

B

26/106

G02B 7/00 (2006.01) G02B 6/42 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1280876

ABSTRACT Optical Component Mounting An improved technique for mounting optical components on a substrate comprises providing each component with a dedicated heating element on the component itself to permit controlled and well-localised heating of solder on the substrate during fixing. In the example illustrated the optical component is an optical fibre carrier comprising fibre(10), carrier plate(12) and heating element(20), which itself comprises an ink film resistor(22) deposited on a ceramic chip(21) having metallised electrical contacts(23).

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