Optical device package

Details Optical device package Optical device package

H - Electricity

05

K

345/62

H05K 3/34 (2006.01) G02B 6/42 (2006.01) H01L 31/02 (2006.01) H01L 31/0203 (2006.01) H01L 33/00 (2006.01)

Patent

CA 1267468

OPTICAL DEVICE PACKAGE Abstract of the Disclosure: In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central Portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bond- ing pad by said solder layer, the optical device chip is die-bonded in a stable state.

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