Optical inspection system for solder joints and inspection...

Details Optical inspection system for solder joints and inspection... Optical inspection system for solder joints and inspection...

G - Physics

01

N

356/2

G01N 21/88 (2006.01) G01N 21/956 (2006.01) G01R 31/28 (2006.01) G01R 31/309 (2006.01)

Patent

CA 1318414

OPTICAL INSPECTION SYSTEM FOR SOLDER JOINTS AND INSPECTION METHOD ABSTRACT OF THE DISCLOSURE The adequacy of the fillets (24, 26) by which the lead (22) is soldered to pad (28) on printed circuit board (16) is evaluated by providing low angle diffuse illumination from circular fluorescent lamp (34) and observing the image with a television camera. The electronic image information is digitized and analyzed to produce a signal corresponding to the adequacy of the fillets and thus the adequacy of the solder joint. Automatic inspection is achieved and the signal can be employed to translate the printed wiring board to a new position for automatic inspection of another solder joint.

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