Optical integrated circuitry

G - Physics – 02 – B

Patent

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Details

G02B 6/12 (2006.01) G02B 6/122 (2006.01) G02B 6/26 (2006.01) G02B 6/30 (2006.01) G02B 6/43 (2006.01) G02F 1/00 (2006.01) H01S 5/026 (2006.01) H01S 5/10 (2006.01) H01S 5/125 (2006.01) H01S 5/183 (2006.01)

Patent

CA 2072247

Optical integrated circuitry, performing various of the functions associated with electronic integrated circuitry, is described. Fabrication, importantly to achieve high circuit chip density - typically in the range of 106 as including both devices and interconnecting guides - is dependent upon device/spacing dimension miniaturization resulting from fabrication in very thin layers. Typical layer thickness as retained in fabricated devices and guides, of a maximum of the order of a 1/2 wavelength for relevant photon flux, results in limitation in cross-talk to permit device design rules of one or a few wavelengths.

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