Optical module with improved grounding of an optical element

Details Optical module with improved grounding of an optical element Optical module with improved grounding of an optical element

H - Electricity

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H01L 23/48 (2006.01) G02B 6/42 (2006.01) H01L 21/64 (2006.01) H01L 23/495 (2006.01) H01L 23/50 (2006.01) H01L 23/58 (2006.01) H01L 23/60 (2006.01) H01L 31/02 (2006.01) H01L 31/12 (2006.01) H01L 31/18 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2103611

ABSTRACT OF THE DISCLOSURE An optical functional element is contained in and grounded to a metal package. A grounding lead member, which is connected to a grounding lead pin forming portion via a connecting lead portion, is welded to the outer surface of the metal package either before or after resin molding. - 20 -

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