Orbital wave soldering of printed circuit boards

Details Orbital wave soldering of printed circuit boards Orbital wave soldering of printed circuit boards

B - Operations, Transporting

23

K

356/22

B23K 1/08 (2006.01) B23K 3/06 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1311064

ABSTRACT OF THE DISCLOSURE: The description refers to a device and a procedure for the wavesoldering of printed circuits, in particular for the soldering of components suitable for surface mounting. The soldering wave - or a portion of the same - is formed by molten solder flows progressing in an orbital direction. Said flows can progress horizontally with a direction that cyclically moves between 0 and 360°, causing the removing of gas/air bubbles - in case they are trapped near a component - in any position they stagnate. Any soldering failure due to "dry soldering" is therefore avoided.

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