Organic acids activated low residue no clean solder flux...

Details Organic acids activated low residue no clean solder flux... Organic acids activated low residue no clean solder flux...

B - Operations, Transporting

23

K

B23K 35/363 (2006.01) B23K 35/36 (2006.01)

Patent

CA 2230331

A blend mixture of non-toxic, non-corrosive liquid soldering flux consists essentially of a mixture of short-chain carboxylic acid derivatives of a short to medium-chain hydrocarbon, such as: adipic acid and formic acid in an organic solvent system consists of iso-propanol and ethyl acetate. Neither precleaning nor postcleaning of the pieces being joined is necessary. The flux evaporates completely upon heating, leaving no corrosive residue or other product on the surface of the piece. The composition comprises about, a) 60-95% by weight iso-propanol, b) 0-30% by weight ethyl acetate, c) 1-10% by weight formic acid, c) 0.5-8% by weight adipic acid, and d) 0-10% by weight acetic acid.

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