Organic resin multi-layer wiring substrate and method of...

Details Organic resin multi-layer wiring substrate and method of... Organic resin multi-layer wiring substrate and method of...

H - Electricity

05

K

H05K 1/14 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01) H05K 1/11 (2006.01) H05K 3/46 (2006.01) H05K 3/20 (2006.01)

Patent

CA 2053521

ABSTRACT OF THE DISCLOSURE An organic resin multi-layer wiring substrate comprises a plurality of lamination blocks and a plurality of via holes. Each lamination block is made by alternately laminating a plurality of electrically conductive wiring layers and insulation layers of organic resin. The via holes penetrate each insulation block and also electrically interconnect the lamination blocks. A method of making an organic resin multi-layer wiring substrate comprises steps of forming a plurality of lamination blocks by alternately laminating a plurality of electrically conductive wiring layers and insulation layers of organic resin on hard plates, adhering the two lamination blocks with the laminated layers abutting against each other, removing the hard plate of one of the lamination blocks using appropriate solvent, and forming via holes in the one lamination block and extending into the other lamination block.

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