Organic solderability preservative compositions

Details Organic solderability preservative compositions Organic solderability preservative compositions

C - Chemistry, Metallurgy

23

F

C23F 11/14 (2006.01) B23K 35/36 (2006.01) C23F 11/10 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2243253

Known organic solderability preservatives (OSP) contain an azole compound and are applied on a copper surface from an acidic solution. The OSPs are not visible to the naked eye when applied. A number of dyes compatible with the OSP solution and not interfering with solderability has been identified. The composition containing such a dye can produce a layer which is visible to the naked eye when applied even in a thin layer. The suitable dyes contain a cationic imine group having the general formula <see Fig. 1> where X- is an anion such as chloride, iodide, sulphate, etc., or an organically bonded anionic group such as sulphonate.

Les agents organiques de préservation de la soudabilité (AOPS) connus contiennent un azole et sont appliqués sur une surface de cuivre sous forme de solution acide. Ces AOPS ne sont pas visibles à l'oeil nu une fois appliqués. On a identifié un certain nombre de pigments compatibles avec une solution d'AOPS et n'interférant pas avec la soudabilité. Une composition contenant un tel pigment permet de produire un couche visible à l'oeil nu, même si elle est appliquée sous forme de couche mince. Les pigments utilisables contiennent un groupement imine cationique et ont la formule générale <voir figure 1>, dans laquelle X- est un anion comme le chlore, l'iode, un sulfate, etc., ou un groupement anionique lié par une fonction organique, comme un sulfonate.

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