Organometallic monomers and polymers with improved adhesion

C - Chemistry – Metallurgy – 08 – F

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C08F 230/04 (2006.01) B24D 3/02 (2006.01) B24D 3/28 (2006.01) B24D 3/34 (2006.01) B24D 11/00 (2006.01) C08F 220/00 (2006.01) G03F 7/027 (2006.01)

Patent

CA 2134334

2134334 9323794 PCTABS00028 An energy sensitive composition comprising a monomeric organometallic complex essentially free of nucleophilic groups and which, upon exposure to energy, bonds to basic reactive sites on a substrate via the metal center, leaving the polymerizable group of the complex unreacted and unrestricted; an energy sensitive composition at least one energy sensitive organometallic group is incorporated in or appended to the backbone of a polymer, such that the resulting coordinatively unsaturated organometallic group or groups bond to basic reactive sites on a substrate, thus forming permanent bonds, and further, the adherent compositions are useful in applications such as adhesion of polymers to substrates, protective coatings, printing plates, durable release coatings, primers, binders, and paints.

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