Organosilicon high molecular weight compounds

Details Organosilicon high molecular weight compounds Organosilicon high molecular weight compounds

C - Chemistry, Metallurgy

08

G

23/54, 402/8, 20

C08G 77/00 (2006.01) C01B 31/36 (2006.01) C04B 35/571 (2006.01) C04B 35/63 (2006.01) C08G 77/48 (2006.01) C08G 77/60 (2006.01)

Patent

CA 1102483

Abstract of the Disclosure Organosilicon high molecular weight compounds containing silicon and carbon as the main skeleton components and organosilicon high molecular weight compounds containing silicon and carbon as the main skeleton components and 0.01-20% by weight of at least one foreign element other than silicon, carbon, hydrogen and oxygen have a number average molecular weight of 500-30,000, an intrinsic viscosity of 0.01-1.50 and a silicon carbide residual amount of not less than 40% by weight after baked at a temperature of 800-1,500°C in a non-oxidizing atmosphere and are useful for the production of silicon carbide moldings.

272446

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