Outer lead tape automated bonding system

Details Outer lead tape automated bonding system Outer lead tape automated bonding system

H - Electricity

01

L

356/22, 356/9

H01L 23/48 (2006.01) H01L 21/60 (2006.01) H01L 23/495 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1281435

Abstract of the Disclosure A method for aligning and bonding the outer leads of the conductive fingers of a tape-and-semiconductor-chip sub-assembly to a package substrate is disclosed. Each section of tape is provided with an inner support ring and an outer support ring. The conductive fingers extend from under the inner support ring to under the outer support ring. The outer support ring is spaced away from the inner support ring to expose portions of the tape outer leads therebetween. The tape-and-chip sub-assembly is positioned over the package substrate so the outer leads are in register with the appropriate package substrate leads. A deposit of flux is applied to at least one location between the substrate and outer support ring to bond the sub-assembly to the substrate. The bonded outer support ring prevents the sub-assembly from moving so the leads do not become out of register with the substrate prior to and during the lead bonding process.

545377

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