Over-molded keypad and method of manufacture

Details Over-molded keypad and method of manufacture Over-molded keypad and method of manufacture

H - Electricity

01

H

H01H 13/88 (2006.01)

Patent

CA 2708736

Described is a keypad and its method of manufacture. In one embodiment, a keypad is provided that includes a substrate having a plurality of donut-shaped recesses located at each site of a button for inputting user information, a plurality of cushions each filled with an incompressible fluid (e.g., water), a flex circuit layer, a plurality of metal membranes and an over-molded thermoplastic elastomer layer. During the over-molding of the thermoplastic elastomer layer, the plurality of cushions filled with an incompressible fluid prevents collapse of the space between the flex circuit layer and the plurality of metal membranes. After the layers of the keypad are assembled, the incompressible fluid is removed which leaves a space between the flex circuit layer and the plurality of metal membranes.

L'invention concerne un clavier et son procédé de fabrication. Dans un mode de réalisation, l'invention concerne un clavier comprenant un substrat comportant une pluralité d'encastrements toriques situés sur chaque site d'un bouton pour entrer les informations de l'utilisateur, une pluralité de coussins, chacun rempli d'un fluide incompressible (par exemple de l'eau), une couche de circuit souple, une pluralité de membranes métalliques et une couche d'élastomère thermoplastique surmoulé. Pendant le surmoulage de la couche d'élastomère thermoplastique, la pluralité de coussins remplis d'un fluide incompressible empêche l'effondrement de l'espace entre la couche de circuit souple et la pluralité de membranes métalliques. Une fois que les couches du clavier sont assemblées, le fluide incompressible est retiré, ce qui laisse un espace entre la couche de circuit souple et la pluralité de membranes métalliques.

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