Overlaid corrugated waferboard panel and a process for its...

Details Overlaid corrugated waferboard panel and a process for its... Overlaid corrugated waferboard panel and a process for its...

B - Operations, Transporting

27

N

154/131, 154/80

B27N 3/06 (2006.01) B27N 3/24 (2006.01) B27N 5/00 (2006.01) B32B 3/28 (2006.01) B32B 21/02 (2006.01) B32B 21/13 (2006.01)

Patent

CA 1285466

"OVERLAID CORRUGATED WAFERBOARD PANEL AND A PROCESS FOR ITS MANUFACTURE" Abstract of the Disclosure An overlaid corrugated waferboard panel is provided together with a technique for its manufacture. The overlay may comprise a wood veneer, or the like. The core of the panel comprises wafer board. The single stage process for the panel manufacture involves utilizing a press platen system which is mechanically convertible between a planar and a corrugated configuration. The overlay is first placed on the lower platen which is in the planar configuration. The wafers and a binder resin in admixture are uniformly distributed over the overlay sheet. Optionally, a second overlay sheet is placed over the wafer/binder mat. The platens are biased together to precompress the mat and the overlay in contact therewith. Finally, the platens are converted from the planar to the corrugated configuration, thus forming the overlaid corrugated waferboard panel in a single stage.

613069

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