Overprint copper composition

Details Overprint copper composition Overprint copper composition

H - Electricity

01

B

31/109

H01B 1/02 (2006.01) H01L 23/498 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1278912

TITLE COPPER CONDUCTOR COMPOSITIONS ABSTRACT A fritless copper conductor composition suitable for overprinting on copper consisting essentially of (a) 10-50% wt. finely divided copper particles, (b) 90-50% wt. coarse copper particles, (c) 0.2-2% wt. reducible heavy metal oxide, (d) 0-1.0% refractory metal and (e) 0-5.0% of a high surface area noble metal, all the particles being dispersed in an organic medium.

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