C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 183/06 (2006.01) C09J 183/04 (2006.01)
Patent
CA 2125366
OXIME-FUNCTIONAL MOISTURE-CURABLE HOT MELT SILICONE PRESSURE-SENSITIVE ADHESIVES ABSTRACT A moisture-curable silicone hot-melt adhesive composition is disclosed, which composition comprises (i) a solid hydroxyl-functional organopolysiloxane resin comprising R3SiO1/2 siloxane units and SiO4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, wherein R is selected from hydrocarbon or halogenated hydrocarbon radicals; (ii) a diorganopolysiloxane polymer having silicon- bonded hydroxyl terminal groups and having a viscosity at 25°C. of 100 to 500,000 mPa?s (centipoise), the weight ratio of said resin (i) to said polymer being (ii) in the range 40:60 to 75:25; (iii) a ketoximosilane, the amount of said ketoximosilane being sufficient to provide a molar ratio of X groups to total hydroxyl groups on said resin (i) and said diorganopolysiloxane (ii) of 0.9 to 3; and (iv) optionally, sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free non-slump solid at room temperature, being extrudable at ?150°C. and forming an essentially tack- free elastomer when cured.
Brady Willliam Patrick
Cifuentes Martin Eric
Schoenherr William Joseph
Vincent Gary Allen
Vincent Harold Lewis
Dow Corning Corporation
Gowling Lafleur Henderson Llp
LandOfFree
Oxime-functional moisture-curable hot melt silicone... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Oxime-functional moisture-curable hot melt silicone..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oxime-functional moisture-curable hot melt silicone... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1963700