Oxymethylene polymer molding compositions having enhanced...

Details Oxymethylene polymer molding compositions having enhanced... Oxymethylene polymer molding compositions having enhanced...

C - Chemistry, Metallurgy

08

L

18/1211, 400/420

C08L 59/00 (2006.01) C08L 23/06 (2006.01) C08L 59/02 (2006.01) C08L 77/00 (2006.01) C08L 23/08 (2006.01)

Patent

CA 1235246

ABSTRACT OF THE DISCLOSURE The black speck format on which occurs during the compounding and molding of admixtures of oxymethylene polymers and polyamides having a melting or softening point below that of the oxymethylene polymer can be reduced by adding the polyamide to the oxymethylene polymer as a dispersion of the polyamide in a carrier resin which is inert to the oxymethylene polymer and has a melting or softening point below that of the oxymethylene polymer. The polyamide comprises less than about 50 weight percent of the dispersion.

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