Package

Details Package Package

B - Operations, Transporting

65

D

217/13, 217/14

B65D 81/34 (2006.01) A23L 1/217 (2006.01) B65D 81/26 (2006.01) H05B 6/64 (2006.01)

Patent

CA 1290289

ABSTRACT A package containing an at least partly baked or partly fried food product to be heated in a microwave oven, comprising a steam- and microwave-permeable packaging material. Preferably the porosity of the packaging material is more than 200 ml as measured by the Bendtsen test. The package is especially suitable for reheating microwaveable parfried potato chips.

533524

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