Package

Details Package Package

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/057 (2006.01) H01L 23/31 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H01L 23/66 (2006.01)

Patent

CA 2196268

A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it and the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.

Un boîtier de la présente invention comprend une base moulée à même un cadre de montage en résine, un circuit intégré placé sur le cadre de montage, et un couvercle fait de résine fixé à la base, qui recouvre le circuit intégré. La base comprend un substrat dans lequel est noyé le cadre de montage, un banc de contacts de même forme que le cadre de montage, formé à la périphérie du haut dudit substrat, ledit cadre de montage séparant ledit banc de contacts du substrat, et un ancrage formé à même le cadre de montage. Le circuit intégré est monté sur une région du cadre de montage entourée par le banc de contacts. Le couvercle est fixé à la partie banc de contacts.

Affiliated with

Also associated with

Rating

Package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1895939