Package for crisping the surface of food products in a...

Details Package for crisping the surface of food products in a... Package for crisping the surface of food products in a...

H - Electricity

05

B

217/14

H05B 6/64 (2006.01) B65D 81/34 (2006.01)

Patent

CA 1304045

ABSTRACT OF THE DISCLOSURE A method and apparatus for crisping the surface of a food substance in a microwave oven is disclosed. A thin film susceptor is positioned close to the surface of a food substance. The susceptor heats when it is exposed to microwave radiation. The susceptor preferably is a thin film of metal deposited on a polyester substrate layer. In one embodiment, heating the susceptor causes the polyester layer to shrink, thereby simultaneously creating openings in the susceptor to allow moisture to escape, and breaking the conductivity of the susceptor so that it becomes less responsive to microwave radiation and substantially "turns off." In an alternative embodiment, passageways are pre-cut in the thin film of metal. A single surface of the food substance is made crisp in this manner, while the opposed surface is exposed to the micro- wave oven atmosphere. It has been discovered that a consumer will perceive a food product as crisp if a single surface is made crisp in the manner according to the present invention, and the opposed surface is not soggy or mushy.

571134

Affiliated with

Also associated with

Rating

Package for crisping the surface of food products in a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for crisping the surface of food products in a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for crisping the surface of food products in a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1261176