Package for demolding embossed butter and margarine

A - Human Necessities – 23 – C

Patent

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99/157, 200/34

A23C 15/00 (2006.01)

Patent

CA 1069757

Abstract A package of butter or margarine which is molded with multi-cubic dimensioned embossments permits the con- tents of the package to be demolded within the temperature range of 38° to 48°F without damaging the embossments. The package comprises a film-sheet within the thickness range of 0.005 to 0.20 inch which is thermoformed into a single-walled, unlined cup-like cavity, and butter or margarine is flow filled into the cavity. The side wall of the cavity has an inward taper of an angle no less than 5° in non-embossed portions of the side wall. Peaks of the embossed surface have radii 01° no less than 1/32 inch and angles of no less than 20°.

256434

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