Package for electronic element

Details Package for electronic element Package for electronic element

H - Electricity

01

L

H01L 23/10 (2006.01) H01C 1/02 (2006.01) H01L 23/04 (2006.01) H01L 23/06 (2006.01) H01L 41/053 (2006.01) H03H 9/10 (2006.01)

Patent

CA 2157682

A package for hermetically housing an electronic element has a lid made of metallic foil. The gap between the lid and the main body is sealed with a resin adhesive.

Un boîtier enfermant hermétiquement un composant électronique comporte un couvercle composé d'une feuille métallique. L'interstice entre le couvercle et le corps principal est scellé avec une résine adhésive.

Affiliated with

Also associated with

Rating

Package for electronic element does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for electronic element, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for electronic element will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1771499