Package for emi, esd, thermal, and mechanical shock...

Details Package for emi, esd, thermal, and mechanical shock... Package for emi, esd, thermal, and mechanical shock...

H - Electricity

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H01L 23/58 (2006.01) H01L 23/16 (2006.01) H01L 23/40 (2006.01) H01L 23/552 (2006.01) H01L 23/60 (2006.01)

Patent

CA 1310432

68061-89 ABSTRACT A package for integrated circuit chips, or other elec- trical devices, provides mechanical shock and thermal protection for the chips, and in addition, protects the chips from electro- magnetic interference and electrostatic discharge. The package includes a printed wiring board base for reception of one or more circuit chips, and a conductive heat sink and cover. The conduc- tive heat sink, in conjunction with a reference plane in the wir- ing board base, acts as an EMI shield for the chips. The heat sink is covered with an insulating layer, on top of which, a con- ductive coaling is placed. The conductive coaling is electrically connected to the reference plane, and the two act to protect the chips from electrostatic discharges. Compliant pads support the chips, and a thermally conductive elastomer can he placed on top of each chip between the chips and the inner top surface of the heat sink. The chips are thereby held securely in position, and are thermally connected to the heat sink.

598469

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