Package for housing semiconductor chip, fabrication method...

Details Package for housing semiconductor chip, fabrication method... Package for housing semiconductor chip, fabrication method...

H - Electricity

01

L

H01L 23/29 (2006.01) H01L 21/56 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2452519

The present invention provides an economical package for housing semiconductor chip that allows a semiconductor chip to operate normally and stably over long periods by efficiently transferring heat generated during the operation of the semiconductor chip to the package mount substrate. A package for housing semiconductor chip that has a substrate, whose upper face is provided with a mounting space whereon a semiconductor chip is mounted, and whose opposite sides are provided with a screw mounting part which is a through-hole or notch; a frame, which is provided on the upper face of the substrate so as to enclose the mounting space and whose side or top has a joint for an input/output terminal; and an input/output terminal, which is connected to the joint, wherein at least a portion of the substrate below the semiconductor chip mounting space thereof comprises a metal-diamond composite that is produced by infiltrating a base material in which diamond grains are joined via a metal carbide with a metal containing copper and/or silver as the main component, and the other part including the screw mounting part consists of metal.

Affiliated with

Also associated with

Rating

Package for housing semiconductor chip, fabrication method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Package for housing semiconductor chip, fabrication method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package for housing semiconductor chip, fabrication method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1656781