H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/28 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H01L 23/552 (2006.01) H01L 23/66 (2006.01)
Patent
CA 2398270
method for packaging a circuit including exposed components (2) placed on a printed circuit (1), the circuit com- prising microwave components (3). At least the part of the circuit that contains microwave components (3) is covered with a layer of syntactic foam (7) comprising a matrix of epoxy resin or cyanate ester, filled with microballoons of glass or a ceramic material. Subsequently, the entire circuit is covered with a moisture-proof top layer (8).
La présente invention concerne un procédé permettant de mettre sous boîtier un circuit comprenant des composants exposés placés sur un circuit intégré, le circuit contenant des composants hyperfréquences. On recouvre au moins une partie du circuit contenant les composants hyperfréquences d'une couche de mousse syntactique comprenant une matrice de résine époxyde ou d'ester de cyanate, remplie de microbilles de matière vitreuse ou céramique. On recouvre enfin le circuit tout entier d'une couche de protection imperméable à l'humidité.
Maatman Ivo Antoni Gerardus
Mannak Jan Hendrik
Goudreau Gage Dubuc
Thales Nederland B.v.
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