Package for optoelectronic device on wafer level and...

G - Physics – 02 – B

Patent

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G02B 6/42 (2006.01)

Patent

CA 2523418

An optical apparatus includes a mount substrate (10) an optoelectronic device on the mount substrate (10), a spacer substrate (20), and a sealer substrate (30). The mount substrate (10), the spacer substrate (20) and the sealer substrate (30) are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical apparatus may be made on a wafer level. The wafer is then separated to form a plurality of optical apparatuses. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.

L'invention concerne un châssis optique comprenant un substrat de montage, un dispositif optoélectronique, un substrat d'espacement, et un substrat d'étanchéité. Le substrat de montage, le substrat d'espacement et le substrat d'étanchéité sont empilés dans le sens vertical et ferment de manière hermétique le dispositif optoélectronique. Un contact électrique externe destiné au dispositif optoélectronique est disposé à l'extérieur du substrat d'étanchéité. Au moins une partie du châssis optique peut être fabriquée sur une plaquette. Un élément optique passif peut être disposé sur le substrat d'étanchéité ou sur un autre substrat empilé et fixé à ce dernier.

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