Package for radiation triggered semiconductor device and method

Details Package for radiation triggered semiconductor device and method Package for radiation triggered semiconductor device and method

H - Electricity

01

L

356/161

H01L 31/02 (2006.01) G02B 6/42 (2006.01) H01L 23/051 (2006.01) H01L 31/0203 (2006.01) H01L 31/111 (2006.01)

Patent

CA 1148668

RD-3633 ABSTRACT OF THE DISCLOSURE The invention is a package for radiation triggered semiconductor devices and a method for directing radiation to the radiation receiving region of a semiconductor device mounted in such a package. The package is of the type which has a side wall formed of an electrically insulating material surrounding a central cavity, and top and bottom walls formed of conductive material. The package is hermetically sealable and constructed to withstand externally applied compression. The means and method for radiation triggering of a semiconductor device in the package include optical conduit means extending through and hermetically sealed to the insulat- ing side wall of the enclosure. Radiation is caused to enter the package along a first optical path in said optical conduit means. A prism or other similar means in the cavity redirects the radiation from the first optical path toward a predetermined region in the cavity to trigger a radiation triggered semiconductor device mounted in the package.

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