Packaged integrated circuit chip

Details Packaged integrated circuit chip Packaged integrated circuit chip

H - Electricity

01

L

356/146

H01L 23/48 (2006.01) H01L 23/057 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1238120

ABSTRACT OF THE DISCLOSURE An IC chip package comprises a lead frame support on which lead frame segments are disposed. An IC chip is disposed on a pad area on the lead frame support. There is a cover on the support. A sealant material encircles the IC chip within the confines of the support and cover in order to seal the IC chip from the environment.

480407

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