Packaging assembly for electronic mechanism

Details Packaging assembly for electronic mechanism Packaging assembly for electronic mechanism

H - Electricity

05

K

356/21

H05K 5/00 (2006.01) H05K 3/34 (2006.01) H05K 7/14 (2006.01) H05K 3/32 (2006.01)

Patent

CA 1085962

PACKAGING ASSEMBLY FOR ELECTRONIC MECHANISM ABSTRACT OF THE DISCLOSURE A package assembly for an electronic mechanism includes a housing which receives an electronic circuit board, Studs carried by the housing are connected to the circuit board by a flexible mechanism so that vibrations are dampened and thermal expansion of the connecting mechanism is accommodated, The connecting mechanism not only supports the circuit board within the housing, but also provides an electrical connection between the terminals on the circuit board and the studs, to which the electronic leads are installed which connect the package to other electronic components.

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