Packaging device and base member for packaging

Details Packaging device and base member for packaging Packaging device and base member for packaging

H - Electricity

01

L

H01L 23/02 (2006.01) B81B 7/02 (2006.01) H01L 27/14 (2006.01)

Patent

CA 2730077

An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate (11) having a plurality of through electrodes (11b) arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes (11b) are led out to an external circuit with a contact medium arranged to bypass a sealant (14) being interposed between the group of electrodes and the through electrodes (11b).

L'invention porte sur un dispositif de conditionnement de la taille d'une puce qui atteint un bas coût, une réduction de taille, une réduction d'épaisseur, une réduction de poids, et en outre une fiabilité élevée par utilisation d'un substrat en verre comprenant une électrode traversante. Le dispositif de conditionnement utilise un substrat en verre (11) sur lequel une pluralité d'électrodes traversantes (11b) sont agencées en des positions prédéterminées sur un élément de base d'un boîtier dans lequel un élément de dispositif comprenant un groupe d'électrodes est stocké, et le groupe d'électrodes et l'électrode traversante (11b) sont extraites vers un circuit externe à travers un milieu de contact agencé par mise en dérivation du groupe d'électrodes, de l'électrode traversante (11b) et d'un matériau d'étanchéité (14).

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