G - Physics – 02 – B
Patent
G - Physics
02
B
G02B 26/00 (2006.01)
Patent
CA 2564037
A package is made of a transparent substrate (12) having an interferometric modulator (10) and a back plate (30). A non-hermetic seal (32) joins the back plate to the substrate to form a package, and a desiccant (34) resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
Une enveloppe est constituée d~un substrat transparent (12) composé d~un modulateur interférométrique (10) et d~une plaque de support (30). Un joint non hermétique (32) joint la plaque de support au substrat pour former une enveloppe où se trouve un déshydratant (34). Une méthode pour envelopper un modulateur interférométrique comprend le fait de fournir un substrat transparent et celui de fabriquer un réseau de modulateurs interférométriques sur la face arrière du substrat. Une plaque de support est fournie et un déshydratant est appliqué sur la plaque de support. La plaque de support est fixée à la face arrière du substrat sous conditions ambiantes à l~aide d~un joint arrière, formant ainsi une enveloppe.
Chui Clarence
Cummings William J.
Gally Brian James
Kothari Manish
Palmateer Lauren
Idc Llc
Qualcomm Mems Technologies Inc.
Smart & Biggar
LandOfFree
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