G - Physics – 02 – B
Patent
G - Physics
02
B
G02B 6/12 (2006.01)
Patent
CA 2492893
A planar lightwave circuit device includes one or more planar lightwave circuits (PLCs) each having an optical layer deposited on a substrate, and a package base including one or more support structures for suspending the planar lightwave circuit above a portion of the package base. Each substrate has a first coefficient of thermal expansion, whereas the package base has a second coefficient of thermal expansion. The first and second coefficients of thermal expansion differ such that a change in temperature causes the support to apply one of a compressive and a tensile force to the planar lightwave circuit in a plane within or parallel to the plane of the planar lightwave circuit. The induced stress can modify the optical performance of the PLC device, e.g. to reduce the temperature sensitivity of the device and thus maintain device performance, or for providing efficient passive or dynamic tuning of the device.
Un circuit optique planaire comprend un ou plusieurs circuits optiques planaires (PLC), chacun comportant une couche de fibre optique déposée sur un substrat, et une base de montage comportant un ou plusieurs supports pour suspendre le circuit optique planaire au-dessus d'une portion de la base de montage. Chaque substrat a un premier coefficient de dilatation thermique, tandis que la base de montage a un deuxième coefficient de dilatation thermique. Les premier et deuxième coefficients de dilatation thermique sont différents, de sorte qu'un changement de température fait que le support applique une force de compression ou une force de traction sur le circuit optique planaire dans le plan du circuit optique planaire ou dans un plan parallèle à celui- ci. La contrainte exercée peut modifier la performance optique du dispositif à circuit optique planaire, c'est-à-dire pour réduire la sensibilité thermique du dispositif et donc maintenir l'efficacité du dispositif, ou pour assurer une syntonisation passive ou dynamique efficace du dispositif.
Grobnic Amelia Georgeta
James Robert
Her Majesty In Right Of Canada As Represented By The Minister Of Through The Communications Research Centre Canada
Teitelbaum & Maclean
LandOfFree
Packaging for planar lightwave circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging for planar lightwave circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging for planar lightwave circuits will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1571224