Packaging for planar lightwave circuits

Details Packaging for planar lightwave circuits Packaging for planar lightwave circuits

G - Physics

02

B

G02B 6/12 (2006.01) G02B 6/34 (2006.01) H01L 23/32 (2006.01) H01L 23/34 (2006.01) H01L 35/00 (2006.01)

Patent

CA 2456889

A PLC device includes a planar lightwave circuit having optical layer deposited on a substrate, and a package base including a support for suspending the planar lightwave circuit above a portion of the package base. The substrate has a first coefficient of thermal expansion, whereas the package base has a second coefficient of thermal expansion. The first and second coefficients of thermal expansion differ such that a change in temperature causes the support to apply one of a compressive and a tensile force to the planar lightwave circuit in a plane within or parallel to the plane of the planar lightwave circuit. The induced stress affects the optical performance of the PLC device. For example, the induced stress may be used to reduce the temperature sensitivity of the device, and thus maintain device performance, or for providing efficient dynamic tuning of the device.

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